llc

SALES, CONSULTING AND TRAINING FOR THE MICRO-ELECTRONIC INDUSTRY SPECIALIZING IN WIRE BONDING dIE BONDING AND PULL/SHEAR TESTING

AOI for Microelectronics, SMT and wafer level Packaging

MVP has extensive experience in a wide range of AOI Microelectronics and Packaging applications. MVP works with the world’s leading manufacturers on a global basis. From multiple die bonding and wire bonding technologies to leadframe, ball grid array and surface inspection applications. MVP has the widest applications toolbox of any AOI provider. MVP takes pride in the fact that they supply many complex inspection solutions to diverse industries such as Automotive, Telecoms, Medical Devices, Military, and Space.

CALIFORNIA

TAIWAN

GERMANY

Representing

MANUAL, SEMI-AUTOMATIC AND AUTOMATIC WIRE BONDING EQUIPMENT

TPT wire bonders are made in Germany and are used in the development and production of micro-electronics around the world. Their goal is to support developers in realizing new ideas and applications for microelectronics. Their customers are startups, Universities and Large corporations, in more than 40 countries around the globe. TheHB05 offers manual fine wire bonding. The HB30 offers heavy wire semi-automated bonding with a motorized Z and Y axis operation. The HB16 offers semi-automated bonding with motorized Z and Y operation wire bonders. The HB100 offers a table top fine wire automated wire bonding.

table top die bonding solutions for micro-electronics

For over 30 years, Tresky Switzerland offers table top handling and pick & place systems. As a die bonding solutions provider, they support specific applications with highly accurate and innovative systems. Table Top Epoxy Die Bonding, Eutectic Die Bonding, Flip Chip Bonding, Epoxy/Adhesive Stamping, Epoxy/Adhesive Dispensing using manual and semi-automatic systems. Models T4909-AE, T5100 and T5300 shown below.

SWITZERLAND

BULGARIA

SOLDERING SYSTEMS FOR VACUUM SUPPORTED SOLDERING & sintering

PINK offers innovative soldering and sintering technologies for void free connections of power semiconductors, hybrid- and multi-chip assemblies as well as electronic packages. The whole assortment - from Batch versions for laboratory applications and production of small series right up to fully automated high performance inline systems - offers an identical processing technology and highest performance. A continuous recording of all process data ensures process reliability, quality and trace-ability.

CALIFORNIA

Compact batch VACUUM OVENS FOR REFLOW SOLDERING

Invacu Ltd was established in 2008. The Company offers programmable vacuum ovens for reflow soldering in controllable atmosphere. There are 3 systems offered each with a different size chamber. The VSU28 offers a 260mm x 210mm chamber. The VSU35 offers a 320mm x 320mm chamber. The VSU45 offers a 420mm x 420mm chamber. Infrared lamps provide the heater. Infrared lamps are placed crossed under the tooling plate and in the lid. Process cooling by means of nitrogen flow that blows from the chamber bottom against the tooling plate.

Atmospheric Plasma Systems for High-Volume Manufacturing

SURFX offers In-line, damage-free surface cleaning for improved bonding and adhesion. Argon plasma cleaning enhances bonding and ultimately elevates the durability and quality of products. Surfx Technologies offers unique automated plasma systems that produce atmospheric argon plasma to clean and activate surfaces.

R&D/Low Volume Pressure Curing / Underfill De-Voiding System

Ableprint Technology offers a number of underfill de-voiding systems. Each designed to meet specific needs. The AFM platform offers an R&D solution. Batch systems are also available for larger runs. APT also offers wafer level volume capabilities.

Ultrasonic fine wire, heavy wire, deep access bonding wedges

DeWeyl Tool strives to provide the finest quality bonding wedges in the world. Located in Petaluma, CA (Northern California) in the Sonoma / Napa wine region, their primary business is manufacturing wirebond wedges, die pickup tools, and custom high precision tooling for the semiconductor, aerospace, and medical industries. The wedges they produce are made from ceramic, titanium, and tungsten carbide, and are used in bonding aluminum, gold, copper, and platinum wires.

GERMANY

Automated die bonding solutions for micro-electronics

For over 30 years, TRESKY has been perfecting the art of creating die bonding solutions. TRESKY Automation in Germany offers the Automated T-6000 and the T-8000 die bonder platforms. Offering Automated Epoxy Die Bonding, Eutectic Die Bonding, Flip Chip Bonding, Epoxy/Adhesive Stamping, Epoxy/Adhesive Dispensing systems. TRESKY offers customized interior layouts based on application demands. TRESKY also provides fully automated magazine to magazine material handling solutions. (Center Photo).